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Identifying key process characteristics and predicting etch rate from High-Dimension Datasets

Ragnoli, E. and McLoone, S. and Lynn, S. and Ringwood, J. and Macgearailt, N. (2009) Identifying key process characteristics and predicting etch rate from High-Dimension Datasets. Advanced Semiconductor Manufacturing Conference, 2009. . viii-ix. ISSN 1078-8743

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Abstract

In semiconductor manufacturing advanced process control (APC) refers to a range of techniques that can be used to improve process capability. As the dimensions of electronic devices have decreased, the application of APC has become more and more important for the critical stages of production processes. However, the economic disadvantage of employing APC is that it requires feedback information in the form of downstream metrology data, which is both time consuming and costly to obtain.

Item Type: Article
Keywords: Identifying key process characteristics; predicting etch rate; High-Dimension Datasets;
Subjects: Science & Engineering > Electronic Engineering
Item ID: 1936
Depositing User: Professor John Ringwood
Date Deposited: 19 May 2010 13:53
Journal or Publication Title: Advanced Semiconductor Manufacturing Conference, 2009.
Publisher: IEEE
Refereed: Yes
URI:

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